With the rapid development of 5G mobile communication and portable electronic devices, the electromagnetic interference (EMI) problem and the development of robust electromagnetic shielding materials that protect sensitive electronic devices from interference has become a coherent goal . Electromagnetic shielding materials protect sensitive electronic devices from interference, with compatibility of metallic materials based on their environmental impact having certain limitations such as fast degradation in atmospheric parameter changes. Carbon-based materials, such as carbon nanotubes (CNT), graphene, carbon fiber, carbon black, carbon foams, and aerogels, have made great progress in electromagnetic protection due to their lightweight, high conductivity, outstanding chemical stability, corrosion resistance, good mechanical properties, and good flexibility .

Electrically conductive foams offer an innovative approach to traditional shielding and grounding by providing X-, Y-, and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speed of computers, telecommunications, and aerospace equipment . Conductive foam is usually made from polyurethane foam plated with copper and nickel, operating in a temperature range between −10 and 85°C with compression of 25%–75%. These foams exhibit excellent shielding effectiveness in the high-frequency range, can be used in thicknesses up to several millimeters, and have excellent electric conductivity and high workability due to adhesion and easy die cutting .

Carbon foams are a new generation of materials exhibiting unique properties such as low density, tailorable thermal and electrical conductivity, high-temperature tolerance, high mechanical strength, and good sound and electromagnetic wave absorption . High EMI shielding effectiveness makes carbon foams attractive for EMI shielding applications in the strategic sector, particularly for stealth applications in defense systems. Carbon foam-based EMI shielding improves the stealth of defense systems as the mechanisms of EMI shielding are dominated, which reduces the chance of detection by enemy radars .

Electromagnetic shielding materials include EMI shielding gaskets that absorb effects and prevent inaccurate signals, flickering displays, and other electrical problems . Effective EMI gaskets should possess the following characteristics: good mechanical resilience to withstand abrasion and compression/decompression cycles; high electrical conductivity to facilitate the flow of electromagnetic energy; adequate compression force to ensure reliable and continuous contact; resilience and durability to withstand repeated compression cycles and environmental stresses; and compatibility with the shielded electronic enclosure materials to prevent galvanic corrosion .

Iron powder manufacturing plays a crucial role in EMI shielding applications, with iron-based materials serving as effective shielding components. The major global manufacturers in the high-purity iron powder market include GKN (Hoeganaes), Hoganas, Industrial Metal Powders, JFE Steel Corporation, and Rio Tinto Metal Powders . High-purity iron powder is essential for creating magnetic shielding materials and electromagnetic components. The global high-purity iron market is driven by the rigid demand from new-energy vehicle motors for high-frequency, low-loss soft magnetic materials, as well as aerospace requirements for specialty alloys and precision magnetic shielding environments .

The future of electromagnetic shielding materials and iron powder manufacturing lies in the convergence of advanced materials and manufacturing technologies. Novel shielding materials based on iron(III) oxide, transition metal carbides, and nitrides (MXenes) are being developed, with preparation methods, structure, EMI shielding performance, and application prospects being comprehensively studied . The geometry of shielding materials is also important, with shape-controlled particles being synthesized through methods including precipitation in reverse micelles, colloidal techniques, sol-gel processing, and microwave-assisted methods